Semiconductor arrangement with capacitor

ABSTRACT

A semiconductor arrangement includes a logic region and a memory region. The memory region has an active region that includes a semiconductor device. The memory region also has a capacitor within one or more dielectric layers over the active region, where the capacitor is over the semiconductor device. The semiconductor arrangement also includes a protective ring within at least one of the logic region or the memory region and that separates the logic region from the memory region. The capacitor has a first electrode, a second electrode and an insulating layer between the first electrode and the second electrode, where the first electrode is substantially larger than other portions of the capacitor.

RELATED APPLICATION

This application is a continuation of and claims priority to U.S. patentapplication Ser. No. 16/014,008, titled “SEMICONDUCTOR ARRANGEMENT WITHCAPACITOR” and filed on Jun. 21, 2018, which is a continuation of andclaims priority to U.S. patent application Ser. No. 15/362,759, titled“SEMICONDUCTOR ARRANGEMENT WITH CAPACITOR” and filed on Nov. 28, 2016,which is a divisional of and claims priority to U.S. patent applicationSer. No. 14/087,005, titled “SEMICONDUCTOR ARRANGEMENT WITH CAPACITOR”and filed on Nov. 22, 2013. U.S. patent application Ser. Nos.16/014,008, 15/362,759 and 14/087,005 are incorporated herein byreference.

BACKGROUND

Capacitors are useful to, among other things, store electrical chargewithin circuits.

DESCRIPTION OF THE DRAWINGS

Aspects of the disclosure are understood from the following detaileddescription when read with the accompanying drawings. It will beappreciated that elements and/or structures of the drawings are notnecessarily drawn to scale. Accordingly, the dimensions of the variousfeatures may be arbitrarily increased and/or reduced for clarity ofdiscussion.

FIG. 1 illustrates a portion of a semiconductor arrangement, accordingto some embodiments;

FIG. 2 illustrates a portion of a semiconductor arrangement, accordingto some embodiments;

FIG. 3 illustrates a portion of a semiconductor arrangement, accordingto some embodiments;

FIG. 4 illustrates a portion of a semiconductor arrangement, accordingto some embodiments;

FIG. 5 illustrates a portion of a semiconductor arrangement, accordingto some embodiments;

FIG. 6 illustrates a portion of a semiconductor arrangement, accordingto some embodiments;

FIG. 7 illustrates a portion of a semiconductor arrangement, accordingto some embodiments;

FIG. 8 illustrates a portion of a semiconductor arrangement, accordingto some embodiments;

FIG. 9 illustrates a portion of a semiconductor arrangement, accordingto some embodiments;

FIG. 10 illustrates a portion of a semiconductor arrangement, accordingto some embodiments;

FIG. 11 illustrates a portion of a semiconductor arrangement, accordingto some embodiments; and

FIG. 12 illustrates a method of forming a semiconductor arrangement,according to some embodiments.

DETAILED DESCRIPTION

Some embodiments of the disclosure will be described with reference tothe drawings. The specific embodiments discussed herein are merelyillustrative and do not limit the scope of the disclosure.

One or more techniques for forming a semiconductor device and resultingstructures formed thereby are provided herein.

FIG. 1 is a perspective view illustrating a portion of a semiconductorarrangement 100 according to some embodiments. In some embodiments, thesemiconductor arrangement 100 is formed in or on a substrate 102, wherean active region 103 is formed in the substrate 102. In someembodiments, the substrate 102 comprises at least one of silicon,polysilicon, germanium, or a composite or combination thereof. Accordingto some embodiments, the substrate 102 comprises at least one of anepitaxial layer, a silicon-on-insulator (SOI) structure, a wafer, or adie formed from a wafer.

According to some embodiments, the semiconductor arrangement 100comprises a logic region 110 and memory region 120. In some embodiments,the logic region 110 is formed on or within the active region 103. Insome embodiments, the logic region 110 comprises one or more logiccontacts 116 that are electrically connected within the logic region 110and connected to the active region 103. The logic contacts 116 areformed in any number of ways, such as by a single damascene process,dual damascene process, etc.

According to some embodiments, the memory region 120 comprises one ormore DRAM cells (not shown). In some embodiments, the memory region 120comprises a semiconductor device 112 formed on or within the activeregion 103. In some embodiments, the semiconductor device 112 comprisesat least one of gate region 108 or a source/drain region 106. In someembodiments, one or more shallow trench isolation (STI) regions 104 areformed within the active region 103. In some embodiments, the memoryregion 120 comprises one or more contacts 114 that are electricallyconnected to the source/drain regions 106.

In some embodiments, the semiconductor arrangement 100 comprises one ormore dielectric layers 122 formed over the active region 103. Accordingto some embodiments, the one or more dielectric layers 122 comprise afirst dielectric layer 122 a, a second dielectric layer 122 b, a thirddielectric layer 122 c, a fourth dielectric layer 122 d, and a fifthdielectric layer 122 e. In some embodiments, at least one of thedielectric layers 122 comprise a standard dielectric material with amedium or low dielectric constant, such as SiO₂. In some embodiments, atleast one of the dielectric layers 122 comprise a dielectric materialwith a relatively high dielectric constant. In some embodiments,formation of at least one of the dielectric layers 122 comprises atleast one of thermal growth, chemical growth, atomic layer deposition(ALD), chemical vapor deposition (CVD), or plasma-enhanced chemicalvapor deposition (PECVD).

In some embodiments, the semiconductor arrangement 100 comprises one ormore etch stop layers 118 separating the dielectric layers 122. In someembodiments, the etch stop layers 118 stop an etching process betweenthe dielectric layers 122. According to some embodiments, the etch stoplayers 118 comprise a dielectric material having a different etchselectivity from the dielectric layers 122. In some embodiments, theetch stop layers 118 comprise at least one of SiC, SiN, SiCN, SiCO, CN,or a composite or combination thereof. In some embodiments, formation ofat least one of the etch stop layers 118 comprises at least one ofthermal growth, chemical growth, atomic layer deposition (ALD), chemicalvapor deposition (CVD), or plasma-enhanced chemical vapor deposition(PECVD).

In some embodiments, the semiconductor arrangement 100 comprises a bitline 126. In some embodiments, the bit line 126 extends through thesecond dielectric layer 122 b. According to some embodiments, the bitline 126 comprises a metal material and is connected to a source/drainregion 106 through a contact 115.

In some embodiments, the semiconductor arrangement 100 comprises one ormore metal contacts 124. In an embodiment, the metal contacts 124 extendthrough the third dielectric layer 122 c and the second dielectric layer122 b. In some embodiments, the metal contacts 124 comprise first metalcontacts 124 a and second metal contacts 124 b. The metal contacts 124are formed in any number of ways, such as by a single damascene process,dual damascene process, etc. In some embodiments, the metal contacts 124are connected to the source/drain regions 106 through contacts 114.

Turning to FIG. 2 , according to some embodiments, a first mask layer128 is formed over the fifth dielectric layer 122 e. In someembodiments, the first mask layer 128 covers portions of the logicregion 110 and portions of the memory region 120. In some embodiments,formation of the first mask layer 128 comprises at least one ofdeposition, chemical vapor deposition (CVD), or other suitable methods.In some embodiments, the first mask layer 128 comprises at least one ofoxide, silicon oxide, nitride, silicon nitride, Si₃N₄, or a composite orcombination thereof.

In some embodiments, the first mask layer 128 is patterned, such as viaetching, to form a first mask opening 130, a second mask opening 132 anda third mask opening 134, preferably concurrently or substantially atthe same time or in the same process step or otherwise. In someembodiments, the first mask opening 130 is formed over the first metalcontacts 124 a. In some embodiments, the second mask opening 132 isformed over the second metal contacts 124 b. In some embodiments, thethird mask opening 134 is formed in at least one of the memory region120 or the logic region 110.

Turning to FIG. 3 , according to some embodiments, a first opening 136,a second opening 140, and a third opening 144 are formed in at least oneor more of the dielectric layers 122. In some embodiments, formation ofthe first opening 136, the second opening 140 and the third opening 144comprises etching at least one of the fifth dielectric layer 122 e orthe fourth dielectric layer 122 d using the first mask opening 130, thesecond mask opening 132 and the third mask opening 134 as a guide andthen removing the patterned first mask layer 128. According to someembodiments, an etch chemistry for etching through the fifth dielectriclayer 122 e and fourth dielectric layer 122 d comprises at least one ofC₅F₈, C₄F₆, N₂, Ar, or a composite or combination thereof. In someembodiments, an etch time for etching through at least one of the fifthdielectric layer 122 e or fourth dielectric layer 122 d is between about3 minutes to about 5 minutes. In some embodiments, an etch chemistry foretching through the etch stop layer 118 between the fifth dielectriclayer 122 e and fourth dielectric layer 122 d comprises at least one ofCF₄, N₂, Ar, or a composite or combination thereof.

In some embodiments, a first depth 138 of the first opening 136 iscontrolled by at least one of a timed etch or endpoint detectionprocess. In some embodiments, the first depth 138 is between about 250nm to about 1200 nm. In some embodiments, a second depth 142 of thesecond opening 140 is controlled by at least one of a timed etch orendpoint detection process. In some embodiments, the second depth 142 isbetween about 250 nm to about 1200 nm. In some embodiments, a thirddepth 146 of the third opening 144 is controlled by at least one of atimed etch or endpoint detection process. In some embodiments, the thirddepth 146 is between about 250 nm to about 1200 nm. In some embodiments,the third depth 146 is greater than at least one of the first depth 138or the second depth 142.

Turning to FIG. 4 , according to some embodiments, a first electrodelayer 148 is formed within the first opening 136, the second opening140, and the third opening 144, and over the fifth dielectric layer 122e. In some embodiments, formation of the first electrode layer 148comprises at least one of atomic layer deposition (ALD), sputtering,thermal evaporation or chemical vapor deposition (CVD). In someembodiments, the first electrode layer 148 fills at least one of thefirst opening 136, the second opening 140, or the third opening 144.According to some embodiments, a portion of the first electrode layer148 is formed over a top surface 150 of the fifth dielectric layer 122e. In some embodiments, the first electrode layer 148 comprises aconductive material. In some embodiments, the conductive materialcomprises at least one of Ti, TiN, Ta, TaN, TaC, W, Jr, Ru, Pt,aluminum, copper, polysilicon, or a composite or combination thereof. Insome embodiments, the first electrode layer 148 is electricallyconnected to at least one of the first metal contacts 124 a or secondmetal contacts 124 b.

In some embodiments, the first electrode layer 148 comprises a bottomsurface 151 at a bottom of at least one of a first electrode 166 formedin the first opening 136 or the second opening 140, or at a protectivering 174 formed in the third opening 144, as illustrated in FIG. 5 .Although two instances of the first electrode are illustrated, forproducing two capacitors, any number instances of the first electrodeare contemplated, to yield any number of capacitors. According to someembodiments, at least three dielectric layers 122 are between the bottomsurface 151 and the active region 103. In some embodiments, the at leastthree dielectric layers 122 between the bottom surface 151 and theactive region 103 comprise the third dielectric layer 122 c, the seconddielectric layer 122 b, and the first dielectric layer 122 a. Accordingto some embodiments, at least one dielectric layer 122 is between thebottom surface 151 and the active region 103. In some embodiments, theat least one dielectric layer 122 between the bottom surface 151 and theactive region 103 comprises the first dielectric layer 122 a. Accordingto some embodiments, at least one dielectric layer 122 is between thebottom surface 151 and the bit line 126 disposed above the active region103. In some embodiments, the at least one dielectric layer 122 betweenthe bottom surface 151 and the bit line 126 comprises the thirddielectric layer 122 c. In some embodiments, the dielectric layer 122 incontact with the bottom surface 151 also contains the bit line 126disposed above the active region 103.

Turning to FIG. 5 , in some embodiments, the portion of the firstelectrode layer 148 over the top surface 150 of the fifth dielectriclayer 122 e is removed, such as by CMP or an etching back method. Insome embodiments, a second mask layer 152 is formed over the protectivering 174 and a logic region surface 156 in the logic region 110.

Turning to FIG. 6 , in some embodiments, a fourth opening 158, a fifthopening 160, and a sixth opening 162 are formed, such as via etching atleast one of the fifth dielectric layer 122 e or the fourth dielectriclayer 122 d. According to some embodiments, an etch chemistry foretching through at least one of the fifth dielectric layer 122 e orfourth dielectric layer 122 d comprises at least one of C₅F₈, C₄F₆, N₂,Ar, or a composite or combination thereof. According to someembodiments, an etch chemistry for etching through at least one of thefifth dielectric layer 122 e or fourth dielectric layer 122 d comprisesa wet etching method using a hydrogen fluoride (HF) base chemical. Insome embodiments, an etch time for etching through at least one of thefifth dielectric layer 122 e or the fourth dielectric layer 122 d isbetween about 3 minutes to about 5 minutes. In some embodiments, an etchchemistry for etching through the etch stop layer 118 between the fifthdielectric layer 122 e and fourth dielectric layer 122 d comprises atleast one of CF₄, N₂, Ar, or a composite or combination thereof. In someembodiments, the first electrode 166 has a first electrode width 168,and the protective ring 174 has a protective ring width 173. In someembodiments, the first electrode width 168 is between about 15 nm toabout 180 nm. In some embodiments, the protective ring width 173 isbetween about 1 nm to about 100 nm. In some embodiments, the fourthopening 158 has a fourth depth 159, the fifth opening 160 has a fifthdepth 161 and the sixth opening 162 has a sixth depth 163. In someembodiments, the fourth depth 159 is controlled by at least one of atimed etch or endpoint detection process. In some embodiments, thefourth depth 159 is between about 250 nm to about 1200 nm. In someembodiments, the fifth depth 161 is controlled by at least one of atimed etch or endpoint detection process. In some embodiments, the fifthdepth 161 is between about 250 nm to about 1200 nm. In some embodiments,a sixth depth 163 is controlled by at least one of a timed etch orendpoint detection process. In some embodiments, the sixth depth 163 isbetween about 250 nm to about 1200 nm. In some embodiments, the sixthdepth 163 is less than at least one of the fourth depth 159 or the fifthdepth 161. In some embodiments, less than all of at least one of thefifth dielectric layer 122 e or the fourth dielectric layer 122 d isremoved such that a sidewall of at least one of the first electrode 166or a sidewall of the protective ring 174 are not entirely revealed.

Turning to FIG. 7 , in some embodiments, an insulating layer 164 isformed over the first electrode 166, the protective ring 174, in thefourth opening 158, the fifth opening 160 and the sixth opening 162, andover the logic region surface 156. In some embodiments, the insulatinglayer 164 comprises a dielectric material with a relatively highdielectric constant such as a material comprising at least one of Al₂O₃,ZrO₂, Ta₂O₅, HfO₂, La₂O₃, TiO₂, SiO₂, or a composite or combinationthereof. In some embodiments, the insulating layer 164 comprises astandard dielectric material with a medium or low dielectric constant,such as SiO₂. In some embodiments, formation of the insulating layer 164comprises at least one of thermal growth, chemical growth, atomic layerdeposition (ALD), chemical vapor deposition (CVD), or plasma-enhancedchemical vapor deposition (PECVD).

According to some embodiments, a second electrode 165 is formed over theinsulating layer 164 to form a capacitor 170. Although first 170 a andsecond 170 b capacitors are illustrated, any number of capacitors arecontemplated. In some embodiments, formation of the second electrode 165comprises at least one of atomic layer deposition (ALD), sputtering, orthermal evaporation, chemical vapor deposition (CVD). In someembodiments, the second electrode 165 comprises a conductive material.In some embodiments, a conductive material comprises at least one of Ti,TiN, Ta, TaN, TaC, W, Jr, Ru, Pt, aluminum, copper, polysilicon, or acomposite or combination thereof. According to some embodiments, theinsulating layer 164 is between at least one of the first electrode 166and the second electrode 165, the protective ring 174 and the secondelectrode 165, or the second electrode 165 and an etch stop layer 118.

Turning to FIG. 8 , according to some embodiments a third mask layer 178is formed over the second electrode 165. In some embodiments, formationof the third mask layer 178 comprises at least one of chemical vapordeposition (CVD), or other suitable methods. In some embodiments, thethird mask layer 178 comprises at least one of oxide, silicon oxide,nitride, silicon nitride, Si₃N₄, or a composite or combination thereof.In some embodiments, a fourth mask opening 187 is formed over the logicregion surface 156 by removing, such as by metal etching portions of thethird mask layer 178, second electrode 165 and insulating layer 164 overthe logic region surface 156.

Turning to FIG. 9 , according to some embodiments, the third mask layer178 is removed and an etch stop layer 182 is formed over the secondelectrode 165 and the logic region surface 156. In some embodiments, theetch stop layer 182 stops an etching process from reaching the fifthdielectric layer 122 e. In some embodiments, the etch stop layer 182comprises at least one of SiC, SiN, SiCN, SiCO, CN, or a composite orcombination thereof. In some embodiments, formation of the etch stoplayer 182 comprises at least one of thermal growth, chemical growth,atomic layer deposition (ALD), chemical vapor deposition (CVD), orplasma-enhanced chemical vapor deposition (PECVD). In some embodiments,an oxide layer 180 is formed over the etch stop layer 182. In someembodiments, formation of the oxide layer 180 comprises at least one ofdeposition, chemical vapor deposition (CVD), or other suitable methods.In some embodiments, the oxide layer 180 comprises at least one ofoxide, silicon oxide, nitride, silicon nitride, oxynitride, or SiO₂.

In some embodiments, the capacitor 170 comprises the first electrode166, the insulating layer 164, and the second electrode 165. In someembodiments, the capacitor 170 extends between 1 dielectric layer 122 to10 dielectric layers 122. In some embodiments, a height 199 of thecapacitor 170 is measured from the bottom surface 151 of the firstelectrode 166 to a top capacitor surface 179 of the second electrode165. In some embodiments, the height 199 of the capacitor 170 is betweenabout 250 nm to about 1200 nm.

In some embodiments, a width 198 of the capacitor 170 is measuredbetween opposing side surfaces 181 a and 181 b of the second electrode165. In some embodiments, the width 198 of the capacitor 170 is betweenabout 30 nm to about 200 nm. According to some embodiments, an aspectratio is a measurement of a ratio of the height 199 of the capacitor 170to the width 198 of the capacitor 170. In some embodiments, the aspectratio of the capacitor 170 is between about 5 to about 25.

In some embodiments, a first portion 191 of the insulating layer 164 isa first distance 192 from the active region 103. In some embodiments,the first distance 192 is measured from a first bottom insulatingsurface 195 a of the first portion 191 of the insulating layer 164 to atop active region surface 197 of the active region 103. In someembodiments, a second portion 193 of the insulating layer 164, adjacentthe capacitor 170, is a second distance 194 from the active region 103.In some embodiments, the second distance 194 is measured from a secondbottom insulating surface 195 b of the second portion 193 of theinsulating layer 164 to the top active region surface 197. In someembodiments, the first portion 191 of the insulating layer 164 is overthe first electrode 166. In some embodiments, the second portion 193 ofthe insulating layer 164 is adjacent the capacitor and thus is not overa metal contact 124. In some embodiments, the bottom surface 151 of thefirst electrode 166 is in contact with a metal contact 124. In someembodiments, the metal contact 124, which is in contact with the bottomsurface 151 of the first electrode 166, provides an electricalconnection through the dielectric layer 122 to the semiconductor device112. In some embodiments, the first distance 192 is greater than thesecond distance 194.

In some embodiments, the first electrode, in contact with the metalcontact 124, has a first area, comprising the first electrode width 168times a height of the first electrode, where the height of the firstelectrode 166 corresponds to the first depth 138 illustrated in FIG. 3 .In some embodiments, the second electrode of the capacitor 170 has asecond area. In some embodiments, the first area is at least 5 timesgreater than the second area.

Turning to FIG. 10 , according in some embodiments an etch stop layer184 is formed over the oxide layer 180. According to some embodiments,the etch stop layer 184 comprises a dielectric material having adifferent etch selectivity than the oxide layer 180. In someembodiments, the etch stop layer 184 comprises at least one of SiC, SiN,SiCN, SiCO, CN, or a composite or combination thereof. In someembodiments, formation of the etch stop layer 184 comprises at least oneof thermal growth, chemical growth, atomic layer deposition (ALD),chemical vapor deposition (CVD), or plasma-enhanced chemical vapordeposition (PECVD). In some embodiments, at least one additional oxidelayer 180 is formed over the etch stop layer 184. In some embodiments,multiple additional oxide layers, such as nine layers, are formed overthe etch stop layer 184, with additional etch stop layers separating theadditional oxide layers. In some embodiments, an antireflective coating(ARC) layer 186 is formed such as by CVD or other suitable methods overthe oxide layer 180. In some embodiments, the ARC layer 186 comprisesmetal or metal oxide. In some methods, the ARC layer 186 is formed bydeposition.

Turning to FIG. 11 , according to some embodiments a first oxide opening175 and a second oxide opening 177 are formed in the ARC layer 186, theoxide layer 180 and the etch stop layer 184. The formation of the firstoxide opening 175 and the second oxide opening 177 comprising at leastone of wet etching or dry etching.

According to some embodiments, a pick up contact 188 is formed in thefirst oxide opening 175. In some embodiments, the pick up contact 188extends through the ARC layer 186, the oxide layer 180 and the etch stoplayers 182, 184. In some embodiments, the pick up contact 188 is incontact with the insulating layer 164 and the second electrode 165. Insome embodiments, formation of the pick up contact 188 comprises atleast one of a single damascene process or dual damascene process.

According to some embodiments, a via contact 190 is formed in the secondoxide opening 177. In some embodiments, the via contact 190 extendsthrough the ARC layer 186, the oxide layer 180 and the etch stop layers182, 184. In some embodiments, the via contact 190 is in contact withthe logic contact 116. In some embodiments, formation of the via contact190 comprises at least one of a single damascene process or dualdamascene process.

An example method 200 of forming a semiconductor arrangement, such assemiconductor arrangement 100 according to some embodiments, isillustrated in FIG. 12 .

At 202, according to some embodiments, a first electrode 166 of acapacitor is formed over a metal contact 124, where the metal contact124 is in a dielectric layer 122 and over an active region 103 and hasan electrical connection to a semiconductor device 112 in the activeregion 103, as illustrated in FIG. 6 .

At 204, according to some embodiments, an insulating layer 164 of thecapacitor 170 is formed, such that a first portion 191 of the insulatinglayer 164 is a first distance 192 from the active region 103, a secondportion 193 of the insulating layer 164 adjacent the capacitor 170 is asecond distance 194 from the active region 103 and the first distance192 is greater than the second distance 194, as illustrated in FIG. 9 .In some embodiments, the first distance 192 is measured from a firstbottom insulating surface 195 a to a top active region surface 197. Insome embodiments, the second distance 194 is measured from a secondbottom insulating surface 195 b to the top active region surface 197. Insome embodiments, the first portion 191 of the insulating layer 164 isformed over the first electrode 166. In some embodiments, the secondportion 193 of the insulating layer 164 is adjacent the capacitor andthus is not over a metal contact 124. In some embodiments, the bottomsurface 151 of the first electrode 166 is in contact with a metalcontact 124. In some embodiments, the metal contact 124, which is incontact with the bottom surface 151 of the first electrode 166, providesan electrical connection through the dielectric layer 122 to asemiconductor device 112 in the active region 103, as illustrated inFIG. 9 . At 206 a second electrode 165 is formed over the insulatinglayer 164 to form the capacitor 170, as illustrated in FIG. 9 .

In some embodiments, a semiconductor arrangement comprises an activeregion comprising a semiconductor device, and a capacitor. In someembodiments, the capacitor has a first electrode, a second electrode andan insulating layer between the first electrode and the secondelectrode, such that first portion of the insulating layer is a firstdistance from the active region, and a second portion of the insulatinglayer, adjacent the capacitor, is a second distance from the activeregion. In some embodiments, the first distance is greater than thesecond distance. In some embodiments, the first portion is over a metalcontact formed in a dielectric layer over the active region. In someembodiments, the metal contact provides an electrical connection throughthe dielectric layer to the semiconductor device. In some embodiment,the second portion is over the dielectric layer but not over the metalcontact.

In some embodiments, a semiconductor arrangement comprises a logicregion, a memory region and a protective ring. In some embodiments, theprotective ring is in at least one of the logic region or the memoryregion and separating the logic region from the memory region. In someembodiments, the memory region comprises an active region and acapacitor. In some embodiments, the active region comprises asemiconductor device. In some embodiments, the capacitor is within oneor more dielectric layers over the active region and the capacitor isover the semiconductor device.

In some embodiments, a method of forming a semiconductor arrangementcomprises forming a first electrode of a capacitor over a metal contactand forming an insulating layer of the capacitor. In some embodiments,the metal contact is formed in a dielectric layer over an active regionof the semiconductor arrangement. In some embodiments, the metal contactprovides an electrical connection through the dielectric layer to asemiconductor device of the active region. In some embodiments, theinsulating layer of the capacitor is formed such that a first portion ofthe insulating layer over the first electrode is a first distance fromthe active region and a second portion of the insulating layer, adjacentthe capacitor, over the dielectric layer, but not over the metalcontact, is a second distance from the active region. In someembodiments, the first distance is greater than the second distance.

Although the subject matter has been described in language specific tostructural features or methodological acts, it is to be understood thatthe subject matter of the appended claims is not necessarily limited tothe specific features or acts described above. Rather, the specificfeatures and acts described above are disclosed as example forms ofimplementing at least some of the claims.

Various operations of embodiments are provided herein. The order inwhich some or all of the operations are described should not beconstrued to imply that these operations are necessarily orderdependent. Alternative ordering will be appreciated having the benefitof this description. Further, it will be understood that not alloperations are necessarily present in each embodiment provided herein.Also, it will be understood that not all operations are necessary insome embodiments.

It will be appreciated that layers, regions, features, elements, etc.depicted herein are illustrated with particular dimensions relative toone another, such as structural dimensions and/or orientations, forexample, for purposes of simplicity and ease of understanding and thatactual dimensions of the same differ substantially from that illustratedherein, in some embodiments. Additionally, a variety of techniques existfor forming the layers, regions, features, elements, etc. mentionedherein, such as implanting techniques, doping techniques, spin-ontechniques, sputtering techniques, growth techniques, such as thermalgrowth and/or deposition techniques such as chemical vapor deposition(CVD), for example.

Moreover, “exemplary” is used herein to mean serving as an example,instance, illustration, etc., and not necessarily as advantageous. Asused in this application, “or” is intended to mean an inclusive “or”rather than an exclusive “or”. In addition, “a” and “an” as used in thisapplication and the appended claims are generally be construed to mean“one or more” unless specified otherwise or clear from context to bedirected to a singular form. Also, at least one of A and B and/or thelike generally means A or B or both A and B. Furthermore, to the extentthat “includes”, “having”, “has”, “with”, or variants thereof are used,such terms are intended to be inclusive in a manner similar to the term“comprising”. Also, unless specified otherwise, “first,” “second,” orthe like are not intended to imply a temporal aspect, a spatial aspect,an ordering, etc. Rather, such terms are merely used as identifiers,names, etc. for features, elements, items, etc. For example, a firstregion and a second region generally correspond to region A and region Bor two different or two identical regions or the same type region.

Also, although the disclosure has been shown and described with respectto one or more implementations, equivalent alterations and modificationswill occur to others skilled in the art based upon a reading andunderstanding of this specification and the annexed drawings. Thedisclosure comprises all such modifications and alterations and islimited only by the scope of the following claims. In particular regardto the various functions performed by the above described components(e.g., elements, resources, etc.), the terms used to describe suchcomponents are intended to correspond, unless otherwise indicated, toany component which performs the specified function (e.g., that isfunctionally equivalent), even though not structurally equivalent to thedisclosed structure. In addition, while a particular feature of thedisclosure may have been disclosed with respect to only one of severalimplementations, such feature may be combined with one or more otherfeatures of the other implementations as may be desired and advantageousfor any given or particular application.

What is claimed is:
 1. A method of forming a semiconductor arrangement, comprising: forming a first dielectric layer and a second dielectric layer over the first dielectric layer; etching the first dielectric layer and the second dielectric layer to define a first opening; forming a first electrode in the first opening; etching the first dielectric layer and the second dielectric layer to expose a sidewall of the first electrode; forming a conformal insulating layer over the first electrode; forming a second electrode over the conformal insulating layer; removing a portion of the conformal insulating layer and a portion of the second electrode after forming the second electrode to define a sidewall of the conformal insulating layer and a sidewall of the second electrode; and forming an etch stop layer over the second electrode, wherein the etch stop layer is laterally coincident with the sidewall of the conformal insulating layer and the sidewall of the second electrode.
 2. The method of claim 1, comprising: etching the first dielectric layer and the second dielectric layer to define a second opening; forming a protective ring in the second opening; and etching the first dielectric layer and the second dielectric layer to expose a first sidewall of the protective ring.
 3. The method of claim 2, wherein a second sidewall of the protective ring remains concealed by the first dielectric layer and the second dielectric layer after etching the first dielectric layer and the second dielectric layer to expose the first sidewall of the protective ring.
 4. The method of claim 2, wherein forming the first electrode and forming the protective ring are performed concurrently.
 5. The method of claim 2, wherein the etch stop layer is laterally between the first electrode and the protective ring.
 6. The method of claim 1, wherein the etch stop layer is laterally coincident with the first electrode.
 7. The method of claim 1, comprising: etching the first dielectric layer and the second dielectric layer to define a second opening; and forming a third electrode in the second opening, wherein: etching the first dielectric layer and the second dielectric layer to expose the sidewall of the first electrode comprises etching a portion of the first dielectric layer and a portion of the second dielectric layer between the first electrode and the third electrode, and etching the first dielectric layer and the second dielectric layer to expose the sidewall of the first electrode further exposes a sidewall of the third electrode.
 8. The method of claim 7, wherein the etch stop layer is laterally between the first electrode and the third electrode.
 9. The method of claim 7, comprising: forming a third dielectric layer over the second electrode, wherein the third dielectric layer is laterally between the first electrode and the third electrode.
 10. A method of forming a semiconductor arrangement, comprising: forming a first dielectric layer; etching the first dielectric layer to define a first opening and a second opening; forming a first electrode in the first opening and a second electrode in the second opening; etching the first dielectric layer to define a third opening; forming an insulating layer in the third opening; forming a third electrode in the third opening, wherein the first electrode is spaced apart from the second electrode by the insulating layer and the third electrode; and forming a second dielectric layer in the third opening over the third electrode, wherein the first electrode is spaced apart from the second electrode by the second dielectric layer.
 11. The method of claim 10, comprising: forming an etch stop layer in the third opening, wherein the first electrode is spaced apart from the second electrode by the etch stop layer.
 12. The method of claim 11, wherein forming the second dielectric layer comprises forming the second dielectric layer in the third opening over the etch stop layer.
 13. The method of claim 10, comprising: etching the first dielectric layer to define a fourth opening; forming a protective ring in the fourth opening; and etching the first dielectric layer to define a fifth opening between the second electrode and the protective ring.
 14. The method of claim 13, wherein forming the first electrode, the second electrode, and the protective ring are performed concurrently.
 15. A method of forming a semiconductor arrangement, comprising: forming a first dielectric layer; etching the first dielectric layer to define a first opening and a second opening; forming a first electrode in the first opening and a second electrode in the second opening; etching the first dielectric layer to define a third opening; forming an insulating layer in the third opening; forming a third electrode in the third opening; and forming a second dielectric layer in the third opening over the third electrode, wherein the first electrode is spaced apart from the second electrode by the second dielectric layer.
 16. The method of claim 15, comprising: forming an etch stop layer in the third opening before forming the second dielectric layer, wherein the first electrode is spaced apart from the second electrode by the etch stop layer.
 17. The method of claim 15, comprising: removing a portion of the insulating layer and a portion of the third electrode to define a sidewall of the insulating layer and a sidewall the third electrode; and forming an etch stop layer over the third electrode, wherein the etch stop layer is laterally coincident with the sidewall of the insulating layer and the sidewall the third electrode.
 18. The method of claim 17, comprising: forming a pickup contact adjacent the sidewall of the third electrode.
 19. The method of claim 15, comprising: etching the first dielectric layer to define a fourth opening; forming a protective ring in the fourth opening; and etching the first dielectric layer to define a fifth opening between the second electrode and the protective ring.
 20. The method of claim 19, wherein forming the first electrode, the second electrode, and the protective ring are performed concurrently. 